ODM Blind And Buried Vias: Expert Solutions for Advanced PCB Design
Shenzhen Cirket Electronics Co., Ltd. specializes in providing high-quality ODM blind and buried vias for all your circuit board needs. Our blind and buried vias are designed to meet the demands of today's complex PCB designs, providing a reliable solution for connecting multiple layers without sacrificing signal integrity, Our blind vias are drilled from the surface of the outer layer and stop at the next adjacent inner layer, while buried vias are completely contained within the inner layers of the PCB. This allows for greater design flexibility and increased routing density, making our blind and buried vias the perfect choice for high-density interconnects, Whether you require HDI technology, microvias, or any other advanced PCB design needs, Shenzhen Cirket Electronics Co., Ltd. has the expertise and capabilities to meet your requirements. Our team of experienced engineers and state-of-the-art manufacturing equipment ensures that our blind and buried vias are produced to the highest standards, providing you with a reliable and cost-effective solution for your PCB needs
