6 Layer Multilayer PCB Assembly with Buried Hole

Shenzhen Cirket Electronics Co.,Ltd, we take pride in our expertise in producing mainboards for smart wearable devices and mobile devices. With 9 SMT lines and 2 DIP lines, we have the capability to offer a full turnkey solution for our customers. Our one-stop service includes purchasing components, assembly in our factory, and arranging logistics, providing an efficient and seamless process for our clients.

product details

product description

1	Material Sourcing	Component,metal,plastic,etc.
2	SMT	9 million chips per day
3	DIP	2 million chips per day
4	Minimum Component	01005
5	Minimum BGA	0.3mm
6	Maximum PCB	300x1500mm
7	Minimum PCB	50x50mm
8	Material Quotation Time	1-3 days
9	SMT and assembly	3-5 days

A 6-layer PCB (Printed Circuit Board) is a type of multilayer PCB that consists of six layers of conductive material separated by insulating layers (dielectric material). Each layer can be used to route signals, provide power and ground planes, and create connections between components. Here's an introduction to 6-layer PCBs:

1. Layer Configuration: A 6-layer PCB typically consists of the following layers, starting from the outermost layers and moving inward:

● Top Signal Layer

● Inner Signal Layer 1

● Inner Signal Layer 2

● Inner Ground or Power Plane

● Bottom Signal Layer

2. Signal Routing: The top and bottom signal layers, as well as the inner signal layers, are used for routing signals between components on the PCB. These layers contain traces that carry electrical signals between components such as ICs (Integrated Circuits), connectors, and passive components.

3. Power and Ground Planes: The inner layers of the PCB are often dedicated to power and ground planes. These planes provide stable voltage references and low-impedance paths for power distribution and signal return paths, respectively. Having dedicated power and ground planes helps to reduce electromagnetic interference (EMI), improve signal integrity, and provide better noise immunity.

4. Stackup Design: The arrangement and ordering of layers in a 6-layer PCB stackup are crucial for achieving desired electrical performance and signal integrity. PCB designers carefully consider factors such as signal propagation delay, impedance control, and electromagnetic coupling when designing the stackup.

5. Inter-Layer Connections: Vias are used to establish electrical connections between different layers of the PCB. Through-hole vias penetrate through all layers of the board, while blind vias connect an outer layer to one or more inner layers, and buried vias connect two or more inner layers without penetrating the outer layers.

6. Applications: 6-layer PCBs are commonly used in electronic devices and systems that require moderate-to-high complexity, such as networking equipment, industrial controls, medical devices, telecommunications devices, and consumer electronics. They offer sufficient routing space and layer count to accommodate complex circuits while maintaining signal integrity and reliability.

7. Design Considerations: Designing a 6-layer PCB requires careful consideration of factors such as signal integrity, power distribution, thermal management, and manufacturability. PCB design software tools are often used to assist with layout, routing, and simulation to ensure that the final design meets the required specifications and performance criteria.