I-High Frequency Material PCB Assembly
incazelo yomkhiqizo
1 | Ukuthola Izinto | Ingxenye, insimbi, ipulasitiki, njll. |
2 | I-SMT | 9 million chips ngosuku |
3 | I-DIP | 2 million chips ngosuku |
4 | Ingxenye encane | 01005 |
5 | I-BGA encane | 0.3mm |
6 | Inani eliphakeme kakhulu lama-PCB | 300x1500mm |
7 | I-PCB encane | 50x50mm |
8 | Isikhathi Sokucaphuna Okubalulekile | 1-3 izinsuku |
9 | I-SMT nokuhlanganisa | 3-5 izinsuku |
Ama-PCB anemvamisa ephezulu anezici ezimbalwa ezihlukile nokucatshangelwa kwesakhiwo uma kuqhathaniswa nama-PCB ajwayelekile:
1. Ukukhetha Okubalulekile: Ama-PCB anemvamisa ephezulu avamise ukusebenzisa izinto ezikhethekile ezinezakhiwo zikagesi ezinhle kakhulu ukuze kuncishiswe ukulahleka kwesignali nokugcina ubuqotho besignali kumafrikhwensi aphezulu. Izinto ezijwayelekile zifaka ama-PTFE (Polytetrafluoroethylene) ama-substrates afana ne-Teflon, kanye nama-laminates amafrikhwensi aphezulu afana ne-FR-4 anezici ze-dielectric ezithuthukisiwe.
2. I-Dielectric Yokulahlekelwa Okuphansi:Impahla ye-dielectric esetshenziswa kuma-PCB anemvamisa ephezulu ikhethelwa i-low dielectric constant (Dk) kanye ne-low dissipation factor (Df), esiza ukunciphisa ukuncishiswa kwesignali nokuhlanekezela kumafrikhwensi aphezulu.
3. Ukuphazamiseka okulawulwayo: Ama-PCB anemvamisa ephezulu ngokuvamile adinga ukulawulwa okunembile kwe-impedance ukuze kuqinisekiswe ukudluliswa kwesignali okusebenzayo kanye nokunciphisa ukubonakaliswa. Landelela ububanzi, ubukhulu be-dielectric, nokulungiselelwa kwesitaki sesendlalelo kudizayinelwe ngokucophelela ukuze kuzuzwe isici esifiselekayo.
4. Ukugawula kanye nokuvikela: Amasu afanele okubeka phansi kanye nokuvikela abalulekile ekwakhiweni kwe-PCB yemvamisa ephezulu ukuze kuncishiswe ukuphazamiseka kwe-electromagnetic (EMI) nokuqinisekisa ubuqotho besignali. Izindiza eziphansi, imikhondo yokuqapha, nezingqimba ezivikelayo zisetshenziselwa ukunciphisa i-crosstalk nomsindo.
5. Idizayini yolayini wokudlulisa: Amasiginali wefrikhwensi ephezulu kuma-PCB aziphatha kakhulu njengezintambo zokudlulisela kunezintambo ezilula zikagesi. Izimiso zokuklama kolayini wokudlulisa, njengemigqa ye-impedance elawulwayo, ukulungiswa kwe-microstrip noma i-stripline, nezindlela zokufanisa i-impedance, zisetshenziswa ukuze kuthuthukiswe ubuqotho besignali kanye nokunciphisa ukuwohloka kwesignali.
6. Ukubekwa Kwengxenye kanye Nomzila:Ukubekwa ngokucophelela nomzila wezingxenye nokulandelelwa kwesignali kubalulekile ekwakhiweni kwe-PCB yemvamisa ephezulu ukuze kuncishiswe ubude bendlela yesiginali, kugwenywe ukugoba okubukhali, nokunciphisa imithelela ye-parasitic engonakalisa ikhwalithi yesignali.
7. Izixhumi ze-High-Frequency:Izixhumi ezisetshenziswa kuma-PCB anemvamisa ephezulu zikhethwa ngenxa yezimpawu zazo ezihambisana ne-impedance kanye nokulahlekelwa kokufakwa okuphansi ukuze kuncishiswe ukuboniswa kwesignali nokugcina ubuqotho besignali kumafrikhwensi aphezulu.
8. Ukuphatha Okushisayo: Kwezinye izinhlelo zokusebenza ze-high-frequency yamandla aphezulu, ukuphathwa kwe-thermal kuba okubalulekile ukuvimbela ukushisisa kwezingxenye kanye nokugcina ukusebenza okuthembekile. Osinki bokushisa, i-thermal vias, kanye namasu okuphatha okushisayo asetshenziswa ukuze kukhishwe ukushisa ngempumelelo.
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