PCB Factory
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Ile-iṣẹ PCB wa ti o wa ni agbegbe Jiangxi wa ni ọdun 2017, amọja ni PCB lile ati FPC mejeeji. Iwọn ọgbin diẹ sii ju awọn mita mita 10,000, ati agbara iṣelọpọ 50,000 square mita. A ti gba UL, ISO9001, ISO14001,IATF16949 ati OHSAS18001 awọn iwe-ẹri ni 2018. Gbogbo ilana ati ẹrọ ti wa ni ilọsiwaju ni gbogbo ọdun. PCB wa ni a lo egan ni iṣakoso ile-iṣẹ, IOT, robot, iṣoogun, ẹrọ itanna olumulo ati bẹbẹ lọ.
Agbara iṣelọpọ Cirket | ||
1 | Layer | 1-30 |
2 | Max.Panel iwọn | 560x1900mm |
3 | Min.via/PTH iwọn oruka | 4mil(0.1mm) /5mili (0.13mm) |
4 | Max.PTH iho iwọn | 6.5mm |
5 | Min.Line aaye / iwọn | 3mil (0.075mm) / 3 mil (0.075mm) |
6 | Min.Inner Layer PAD | 4 mil (0.1mm) |
7 | Min.inner Layer sisanra | 4 mil (0.1mm) |
8 | Inu Layer Cu.weight | 0,5-5,0 iwon |
9 | Iho odi sisanra | 18-30um |
10 | HASL tin sisanra | 150-1000u" (3.75-25um) |
11 | Outlayer Cu.àdánù | 0,5-5,0 iwon |
12 | Board sisanra ibiti o | 0.4-3.2mm |
13 | Board sisanra ifarada | +/- 10% |
14 | Titete akopọ | +/- 2 miliọnu (50um) |
15 | Min. iho | 0.15mm |
16 | Iho to iho ipo | +/- 2 miliọnu (50um) |
17 | Iho ifarada | +/- 2 miliọnu (50um) |
18 | Nipasẹ iho aspect ratio | 10:1 |
19 | PAD titete deede | 3mil (0.075mm) / 3 mil (0.075mm) |
20 | Etching ifarada | +/- 10% |
mọkanlelogun | Min.soldermask Afara | 3 milionu (0.075mm) |
meji-le-logun | Max.plug nipasẹ iho | 0.5mm |
mẹta-le-logun | Dada itọju | HASL,ENIG,OSP, fadaka immersion |
mẹrin-le-logun | Max.lile goolu sisanra | 30u" (0.75um) |
25 | GBA nipọn | Au 1-3u", Ni.:100-300u" |
26 | Ifarada impedance | +/- 10% |
27 | Max.lilọ ati ija | 0.75% |