High Frequency Material PCB Assembly
Ingcaciso yeMveliso
1 | Ukufumana izinto eziphathekayo | Icandelo, isinyithi, iplastiki, njl. |
2 | SMT | I-9 yezigidi zeetshiphusi ngosuku |
3 | DIP | 2 million chips ngosuku |
4 | Ubuncinci beCandelo | 01005 |
5 | Ubuncinci be-BGA | 0.3mm |
6 | Ubuninzi bePCB | 300x1500mm |
7 | Ubuncinci bePCB | 50x50mm |
8 | Ixesha leNtelekelelo yoMsebenzi | 1-3 iintsuku |
9 | I-SMT kunye nendibano | 3-5 iintsuku |
Ii-PCBs ezikwi-frequency ephezulu zineempawu ezininzi ezahlukileyo kunye noqwalaselo loyilo xa kuthelekiswa neePCB eziqhelekileyo:
1. Ukukhethwa kwezinto: Ii-PCB ze-frequency ephezulu zihlala zisebenzisa izixhobo ezikhethekileyo ezineempawu ezibalaseleyo zombane ukunciphisa ilahleko yomqondiso kunye nokugcina imfezeko yomqondiso kumaza aphezulu. Izinto eziqhelekileyo ziquka i-PTFE (i-Polytetrafluoroethylene) i-substrates efana neTeflon, kunye ne-high-frequency laminates njenge-FR-4 eneempawu eziphuculweyo ze-dielectric.
2. Ilahleko ephantsi yeDielectric:Isixhobo se-dielectric esisetyenziswe kwi-PCB ephezulu-frequency ikhethwa kwi-dielectric constant constant (Dk) kunye ne-low dissipation factor (Df), enceda ukunciphisa ukutshatyalaliswa komqondiso kunye nokuphazamiseka kwiifrikhwensi eziphezulu.
3. UZinzo oluLawulwayo: Ii-PCB ze-Frequency High-frequency zihlala zifuna ulawulo oluchanekileyo lwe-impedance ukuqinisekisa ukuhanjiswa komqondiso okusebenzayo kunye nokunciphisa ukubonakaliswa. Umkhondo ububanzi, ubukhulu be-dielectric, kunye nolungelelwaniso lwe-stackup luyilwe ngononophelo ukufezekisa i-impedance yeempawu ezifunekayo.
4. Ukumhlaba kunye nokuKhusela: Iindlela ezifanelekileyo zokubeka umhlaba kunye neendlela zokukhusela zibalulekile kuyilo lwePCB olukwi-frequency ephezulu ukunciphisa uphazamiseko lwe-electromagnetic (EMI) kunye nokuqinisekisa imfezeko yomqondiso. Iinqwelomoya ezisezantsi, umkhondo wokugada, kunye neengqimba ezikhuselayo zisetyenziselwa ukunciphisa i-crosstalk kunye nengxolo.
5. UYilo lweNdlela yoThutho: Imiqondiso yefrikhwensi ephezulu kwii-PCB ziziphatha njengeentambo zothumelo kuneendlela ezilula zombane. Imigaqo yoyilo lomgca wothumelo, njengeentambo ezilawulwayo ze-impedance, i-microstrip okanye ulungelelwaniso lwe-stripline, kunye nobuchule bokuthelekisa i-impedance, zisetyenziselwa ukwandisa imfezeko yomqondiso kunye nokunciphisa ukuthotywa komqondiso.
6. Ukubekwa kweCandelo kunye noNdlela:Ukubekwa ngononophelo kunye nomzila wamacandelo kunye nezalathisi zesignali zibalulekile kuyilo lwe-PCB olukwi-frequency ephezulu ukunciphisa ubude bendlela yomqondiso, ukuphepha ukugoba okubukhali, kunye nokunciphisa iziphumo zeparasitic ezinokuthobisa umgangatho wesignali.
7. Iziqhagamshelo eziPhezulu-Frequency:Iziqhagamshelo ezisetyenziswa kwii-PCB ezikwi-frequency ephezulu zikhethwa ngenxa yeempawu ezihambelana ne-impedance kunye nelahleko ephantsi yokufaka ukunciphisa ukubonakalisa umqondiso kunye nokugcina imfezeko yesiginali kwiifrikhwensi eziphezulu.
8. Ulawulo lweThermal: Kwezinye izicelo eziphezulu ze-high-frequency, ulawulo lwe-thermal luba lubalulekile ekuthinteleni ukufudumeza kwamacandelo kunye nokugcina ukusebenza okuthembekileyo. I-Heat sinks, i-thermal vias, kunye neendlela zokulawula ukushisa zisetyenziselwa ukuchitha ubushushu ngokufanelekileyo.
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