PCBA Feme
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Cirket ke feme e etelletseng pele ea PCBA e thehiloeng ka 2007, e fanang ka ts'ebeletso e felletseng ea tharollo ea senotlolo ho tsoa ho lisebelisoa tsa likarolo, SMT, DIP, soldering ea letsoho, tlhahlobo le kopano ea mochini.Re na le lefapha la R&D la boenjiniere ba 15, le fanang ka litšebeletso tsa ODM. E ka ba boqapi ba PCB, moralo oa sebopeho, le nts'etsopele ea software. -
Bokhoni ba Tlhahiso ea Cirket 1 Min. PCB e sebetsang ka boholo 50x50 limilimithara 2 Boholo. PCB e sebetsang ka boholo 460x1500 limilimithara 3 Min.component 01005 4 Min. QFP sekhahla 0.30 limilimithara 5 Sekhahla sa Min.IC 0.30 nm 6 Min.BGA Ball 0.25 limilimithara 7 Max. Bophahamo ba SMT 20 limilimithara 8 Max. BGA boholo 74x74 limilimithara 9 SMT bokhoni Li-chips tse limilione tse 9.5 ka letsatsi 10 Bokhoni ba DIP 700,000 likotoana / letsatsi 11 Mekhoa ea SMT 9 12 DIP mela 2 13 Mehala ea kopano ea mechine 1
Ho na le mela e 9 ea SMT, semela sa lisekoere-mithara tse 4000, li-empolyees tse 100. Mohala o mong le o mong o na le printa e le 'ngoe ea solder paste, e le 'ngoe ea lebelo le phahameng la YAMAHA chip mounter, tse peli tsa multifunction chip mounter, le mochini o le mong oa 10 oa oven reflow soldering. Bokhoni ke li-chips tse 100,000 ka hora mola o mong le o mong. Liboto tsohle ka mor'a SMT li tla hlahlojoa ke AOI. Karolo e nepahetseng joalo ka BGA e tla behoa lihora tse fetang 12 pele ho kopano. Karolo ea BGA le QFN e tla hlahlojoa ka X-ray hora e 'ngoe le e 'ngoe ha e ntse e eketseha.
Ho na le mohala o le mong oa DIP, mohala o le mong oa solder le mohala oa kopano oa mochini. Mekhoa eohle ea ho kopanya e felile fekthering ea rona.
Re hlahisitse mefuta ea liboto tse kang lisebelisoa tsa elektroniki tsa bareki, lisebelisoa tsa bongaka, indasteri ea mabone, sehlahisoa sa ts'ireletso, boto ea taolo ea indasteri, puisano joalo-joalo, ho fumana boiphihlelo bo ruileng ho boto e thata le kopano ea FPC.
Cirket e ka ba e mong oa barekisi ba hau ba hloahloa.