Multilayer PCB ine BGA Chikamu Musangano
rondedzero yechigadzirwa
1 | Material Sourcing | Chikamu, simbi, plastiki, nezvimwewo. |
2 | SMT | 9 miriyoni machipisi pazuva |
3 | DIP | 2 miriyoni machipisi pazuva |
4 | Minimum Component | 01005 |
5 | Minimum BGA | 0.3mm |
6 | Maximum PCB | 300x1500mm |
7 | Minimum PCB | 50x50mm |
8 | Material quote Time | 1-3 mazuva |
9 | SMT uye gungano | 3-5 mazuva |
Kuunza chigadzirwa chedu chitsva, iyo BGA (Bhora Grid Array) Package! Yakagadzirwa neazvino kurongedza tekinoroji, chigadzirwa ichi chinopa yakawedzera kubatanidza magetsi uye nekubatanidzwa kwakanaka kwemaseketi akabatanidzwa (ICs).
Iyo BGA package inomira pachena kune yayo yakavimbika solder maitiro, ayo anosanganisira kubatanidza mabhora esimbi madiki pane gidhi yemapadhi ari pamusoro peIC. Iyi nzira inochengetedza hukama hwakachengeteka pakati peIC uye bhodhi redunhu, zvichiita kuti pave nekuvandudzwa kwekushanda uye kusimba. Iine compact saizi uye yakakwirira-pini kuverenga kugona, yedu BGA package inopa yekucheka-kumucheto mhinduro yeakasiyana midziyo yemagetsi.
KuShenzhen Cirket Electronics Co., Ltd, tanga tichinyanya hunyanzvi mubhizinesi rePCB nePCBA kubvira 2007. Hunyanzvi hwedu huri mukupa mhinduro dzakakwana dzekuchinja kune vatengi veOEM. Kubva pakutanga R&D kuenda kukutsvaga zvinhu, kudhindwa redunhu bhodhi kugadzirwa, kugadzira zvemagetsi, kuungana kwemichina, kuyedza basa, kurongedza, uye zvinhu, isu tinopa huwandu hwakakwana hwesevhisi.
Nepasuru yeBGA, isu tinovavarira kugadzirisa kudiwa kuri kuramba kuchiwedzera kwehunyanzvi hwekurongedza muindasitiri yemagetsi. Iyi gadziriso yekuvandudza ichaita zvinodikanwa zvezvikamu zvakasiyana, zvinosanganisira makomputa, mafoni, mitambo yemitambo, nezvimwe.
Chimwe chakakosha cheBGA package yedu kugona kwayo kuve nechokwadi chekubatanidza magetsi. Mabhora esimbi akatengeswa anopa hukama hwakavimbika pakati peIC uye bhodhi redunhu. Izvi hazvingokwidzi kuita kwese chete asiwo zvinokonzeresa dhizaini yakawanda uye yakakwenenzverwa.
Uyezve, iyo yakakwira-pini yekuverengera yeBGA package yedu inobvumira kuvandudzwa kwekufambisa data uye nekukurumidza kugadzirisa kumhanya. Izvi zvinonyanya kubatsira kune zvishandiso zvinoda computations yakaoma uye data-yakanyanya mashandiro. Nepakeji yedu yeBGA, zvigadzirwa zvemagetsi zvinogona kuwana hukuru hwekuita uye kupindura.
Nekusarudza Shenzhen Cirket Electronics Co., Ltd semumwe wako waunovimba naye, unogona kutarisira yakasarudzika mhando uye masevhisi akavimbika. Chikwata chedu chine ruzivo chakazvipira kuendesa epamusoro-notch zvigadzirwa zvinosangana nepamusoro indasitiri zviyero. Isu tinozvirumbidza pamusoro pezvivakwa zvedu zvekugadzira zvemhando yepamusoro uye dzakasimba kudzora mhando, kuve nechokwadi chekuti yega yega BGA package ndeyekunyanya kunaka.
Mukupedzisa, iyo BGA package ndeye yakasarudzika tekinoroji kufambira mberi mukubatanidzwa kwedunhu kurongedza. Iine compact size yayo, yakakwirira-pini kuverenga kugona, uye inoshanda yekubatanidza magetsi, ndiyo mhinduro yakanaka kune dzakasiyana siyana dzemagetsi. Kudyidzana neShenzhen Cirket Electronics Co., Ltd kune yakazara turnkey mhinduro uye tinakirwe nemabhenefiti ehunyanzvi hwedu muPCB nePCBA bhizinesi. Bata isu izvozvi kuti udzidze zvakawanda nezve iyo BGA package inogona kushandura zvigadzirwa zvemagetsi zvako.
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