High Frequency Material PCB Gungano

Shenzhen Cirket Electronics Co., Ltd, yako-yekumira mhinduro kune ako ese OEM uye ODM PCB uye PCBA zvinodiwa. Yakavambwa muna 2009, isu takakura kuva anotungamira mupi weakazara turnkey masevhisi kune vatengi pasi rese. Iine 9 SMT mitsara uye 2 DIP mitsara, isu tine kugona kubata ese maficha ekugadzira maitiro, kubva pakugadzira uye kutenga zvinhu, kuungana uye kurongeka.

A high-frequency PCB (Printed Circuit Board) inoreva rudzi rwebhodhi redunhu rakagadzirirwa kushanda paredhiyo frequencies (RF) kana microwave frequency. Aya mafambiro anowanzo kubva kumazana emegahertz (MHz) kuenda kune akati wandei gigahertz (GHz) uye anowanzo shandiswa mumashandisirwo akaita sewaya yekutaurirana masisitimu, radar masisitimu, setiraiti kutaurirana, uye yakakwirira-kumhanya kwedhijitari masaini magadzirirwo.

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product details

rondedzero yechigadzirwa

1	Material Sourcing	Chikamu, simbi, plastiki, nezvimwewo.
2	SMT	9 miriyoni machipisi pazuva
3	DIP	2 miriyoni machipisi pazuva
4	Minimum Component	01005
5	Minimum BGA	0.3mm
6	Maximum PCB	300x1500mm
7	Minimum PCB	50x50mm
8	Material quote Time	1-3 mazuva
9	SMT uye gungano	3-5 mazuva

High-frequency PCBs ine akati wandei akasarudzika maitiro uye magadzirirwo ekufunga achienzaniswa neyakajairwa maPCB:

1. Kusarudzwa kwezvinhu: High-frequency PCBs anowanzo shandisa hunyanzvi zvinhu zvine akanakisa magetsi emagetsi kudzikisa kurasikirwa kwechiratidzo uye kuchengetedza chiratidzo chekutendeseka pane yakakwirira frequencies. Zvishandiso zvakajairika zvinosanganisira PTFE (Polytetrafluoroethylene) substrates seTeflon, pamwe neakakwirira-frequency laminates akadai seFR-4 ane yakawedzera dielectric zvivakwa.

2. Yakaderera Kurasikirwa Dielectric:Iyo dielectric zvinhu inoshandiswa mu-high-frequency PCBs inosarudzwa kune yayo yakaderera dielectric constant (Dk) uye yakaderera dissipation factor (Df), iyo inobatsira kudzikisa chiratidzo chekumisikidza uye kukanganisa pakakwirira frequencies.

3. Controlled Impedance: Yakakwira-frequency PCBs inowanzoda kunyatso kudzora kweiyo impedance kuve nechokwadi chekufambisa kwemasaini uye kuderedza kuratidzwa. Trace wides, dielectric makubvu, uye layer stackup masisitimu akanyatso gadzirwa kuti awane inodiwa hunhu impedance.

4. Grounding and Shielding: Maitiro ekuisa pasi uye ekudzivirira akakosha mune yakakwira-frequency PCB dhizaini kudzikisa electromagnetic interference (EMI) uye kuve nechokwadi chekutendeka kwechiratidzo. Ndege dzepasi, mitsetse yevarindi, uye nhovo dzekudzivirira dzinoshandiswa kuderedza crosstalk uye ruzha.

5. Transmission Line Dhizaini: High-frequency masiginecha paPCBs anoita sematambo ekutapurirana kwete kuteera magetsi. Transmission line dhizaini misimboti, senge inodzorwa impedance mitsara, microstrip kana stripline masisitimu, uye impedance yekufananidza matekiniki, inoiswa kukwirisa kutendeseka kwechiratidzo uye kuderedza kuderedzwa kwechiratidzo.

6. Component Placement uye Routing:Kuiswa nekungwarira uye kufambiswa kwezvikamu uye zviratidzo zvechiratidzo zvakakosha mu-high-frequency PCB dhizaini kudzikisa kureba kwenzira yechiratidzo, kudzivirira kubhenda kwakapinza, uye kuderedza mhedzisiro inogona kukanganisa chiratidzo chechiratidzo.

7. High-Frequency Connectors:MaConnector anoshandiswa mu-high-frequency PCBs anosarudzwa kune avo impedance-inofananidzwa maitiro uye yakaderera yekuisa kurasikirwa kuderedza kuratidzwa kwechiratidzo uye kuchengetedza chiratidzo chekuvimbika pamafafitera epamusoro.

8. Thermal Management: Mune mamwe ma-high-power high-frequency applications, thermal management inova yakakosha kudzivirira kupisa kwezvikamu uye kuchengetedza kushanda kwakavimbika. Heat sinks, thermal vias, uye tekinoroji manejimendi anoshandiswa kubvisa kupisa zvinobudirira.