6 Layer Multilayer PCB Gungano neAkavigwa Gomba
rondedzero yechigadzirwa
1 | Material Sourcing | Chikamu, simbi, plastiki, nezvimwewo. |
2 | SMT | 9 miriyoni machipisi pazuva |
3 | DIP | 2 miriyoni machipisi pazuva |
4 | Minimum Component | 01005 |
5 | Minimum BGA | 0.3mm |
6 | Maximum PCB | 300x1500mm |
7 | Minimum PCB | 50x50mm |
8 | Material quote Time | 1-3 mazuva |
9 | SMT uye gungano | 3-5 mazuva |
A 6-layer PCB (Printed Circuit Board) imhando ye multilayer PCB iyo ine nhanhatu dzezvinhu conductive zvakapatsanurwa ne insulating layer (dielectric material). Nheyo yega yega inogona kushandiswa kufambisa masaini, kupa simba uye ndege dzepasi, uye kugadzira hukama pakati pezvikamu. Heino sumo kune 6-layer PCBs:
1. Layer Configuration:Iyo 6-layer PCB inowanzo kuve neaya anotevera akaturikidzana, kutanga kubva kunze kwekunze uye achifamba mukati:
● Top Signal Layer
●Inner Signal Layer 1
●Yemukati Signal Layer 2
●Inner Ground kana Power Plane
●Inner Ground kana Power Plane
●Pazasi Signal Layer
2. Signal Routing: Iwo epamusoro uye epasi masaini akaturikidzana, pamwe chete nemukati masaini masiginecha, anoshandiswa kufambisa masaini pakati pezvikamu paPCB. Aya akaturikidzana ane zviteshi zvinotakura masaini emagetsi pakati pezvinhu zvakaita seICs (Integrated Circuits), zvinobatanidza, uye zvinhu zvinongoitwa.
3. Simba uye Zvirongwa zvepasi: Iwo emukati akaturikidzana ePCB anowanzo kutsaurirwa kune simba uye pasi ndege. Idzi ndege dzinopa mareferensi akagadzikana emagetsi uye nzira dzakaderera-impedance yekugovera magetsi uye nzira dzekudzoka kwechiratidzo, zvichiteerana. Kuve neakazvitsaurira simba uye ndege dzepasi kunobatsira kudzikisira kukanganiswa kwemagetsi (EMI), kunatsiridza kutendeseka kwechiratidzo, uye kupa nani ruzha kusadzivirirwa.
4. Stackup Dhizaini: Kurongeka uye kurongeka kwezvikamu mune 6-layer PCB stackup yakakosha pakuita kwaunoda kuita kwemagetsi uye kutendeseka kwechiratidzo. Vagadziri vePCB vanonyatsofunga zvinhu zvakaita sekunonoka kuparadzira chiratidzo, impedance control, uye electromagnetic coupling pakugadzira iyo stackup.
5. Inter-Layer Connections: Vias inoshandiswa kumisa kubatanidza kwemagetsi pakati pezvikamu zvakasiyana zvePCB. Kuburikidza-gomba vias vanopinda kuburikidza akaturikidzana ose bhodhi, apo mapofu vias batanidza okunze rukoko kune imwe kana kupfuura yomukati akaturikidzana, uye akavigwa vias batanidza maviri kana kupfuura yomukati akaturikidzana pasina kupinda nechokunze akaturikidzana.
6. Zvikumbiro: 6-layer PCBs anowanzo shandiswa mumidziyo yemagetsi uye masisitimu anoda zviri pakati nepakati-kusvika-pamusoro kuomarara, senge networking zvishandiso, maindasitiri ekudzora, midziyo yekurapa, nharembozha, uye zvemagetsi zvevatengi. Ivo vanopa yakakwana nzvimbo yekufambisa uye layer count kuti igare yakaoma masekete uku uchichengetedza chiratidzo chekuvimbika uye kuvimbika.
7. Mafungiro ekugadzira: Kugadzira 6-layer PCB kunoda kunyatsotarisisa zvinhu zvakaita sechiratidzo chekuvimbika, kugovera simba, kutonga kwekupisa, uye kugadzira. PCB dhizaini software maturusi anowanzo shandiswa kubatsira nemarongerwo, nzira, uye simulation kuona kuti yekupedzisira dhizaini inosangana nezvinodiwa uye maitiro ekuita.
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