High zaus khoom PCB los ua ke

Shenzhen Cirket Electronics Co., Ltd, koj qhov kev daws teeb meem ib zaug rau txhua yam koj xav tau OEM thiab ODM PCB thiab PCBA. Tsim los ntawm 2009, peb tau loj hlob los ua tus thawj coj ntawm cov kev pabcuam turnkey rau cov neeg siv khoom thoob ntiaj teb. Nrog 9 SMT kab thiab 2 DIP kab, peb muaj peev xwm tswj tau txhua yam ntawm cov txheej txheem tsim khoom, los ntawm kev tsim thiab kev yuav khoom, mus rau kev sib dhos thiab kev xa khoom.

Ib lub PCB ntau zaus (Printed Circuit Board) yog hais txog ib hom Circuit Court board tsim los ua haujlwm ntawm xov tooj cua zaus (RF) lossis microwave zaus. Cov zaus no feem ntau nyob ntawm ntau pua megahertz (MHz) mus rau ntau lub gigahertz (GHz) thiab feem ntau siv rau hauv cov ntawv thov xws li wireless kev sib txuas lus, radar systems, satellite kev sib txuas lus, thiab high-speed digital signal processing.

Tiv tauj peb

cov khoom paub meej

cov khoom piav qhia

1	Cov khoom siv	Cheebtsam, hlau, yas, thiab lwm yam.
2	SMT	9 lab chips ib hnub twg
3	DIP	2 lab chips ib hnub twg
4	Yam tsawg kawg nkaus	0 1005
5	Yam tsawg kawg nkaus BGA	0.3mm ib
6	Qhov siab tshaj plaws PCB	300 x 1500 mm
7	Yam tsawg kawg nkaus PCB	50 x 50 mm
8	Lub Sijhawm Txiav Txim Khoom	1-3 hnub
9	SMT thiab sib dhos	3-5 hnub

High-frequency PCBs muaj ntau yam tshwj xeeb thiab tsim kev txiav txim siab piv rau cov qauv PCBs:

1. Kev xaiv cov khoom siv: High-frequency PCBs feem ntau siv cov ntaub ntawv tshwj xeeb nrog cov khoom siv hluav taws xob zoo heev kom txo cov teeb liab poob thiab tswj cov teeb liab kev ncaj ncees ntawm cov zaus siab. Cov ntaub ntawv muaj xws li PTFE (Polytetrafluoroethylene) substrates zoo li Teflon, nrog rau cov laminates siab xws li FR-4 nrog cov khoom siv hluav taws xob zoo dua qub.

2. Tsawg Loss Dielectric:Cov khoom siv dielectric siv nyob rau hauv high-frequency PCBs yog xaiv rau nws tsis tshua muaj dielectric tas li (Dk) thiab tsis tshua muaj dissipation factor (Df), uas yuav pab kom txo tau cov teeb liab attenuation thiab distortion ntawm high frequencies.

3. Tswj impedance: High-frequency PCBs feem ntau xav tau kev tswj hwm ntawm impedance los xyuas kom meej cov teeb liab kis tau zoo thiab txo qhov kev xav. Cov kab dav dav, dielectric thicknesses, thiab txheej stackup configurations yog ua tib zoo tsim los ua kom tiav cov yam ntxwv impedance.

4. Grounding thiab shielding: Cov txheej txheem hauv av kom raug thiab tiv thaiv yog qhov tseem ceeb hauv kev tsim PCB ntau zaus kom txo tau electromagnetic cuam tshuam (EMI) thiab xyuas kom meej lub teeb liab. Cov dav hlau hauv av, kev tiv thaiv kab mob, thiab cov khaubncaws sab nraud povtseg yog siv los txo cov lus sib tham thiab suab nrov.

5. Kis Kab Tsim: High-frequency signals ntawm PCBs coj zoo li cov kab sib kis ntau dua li cov kab hluav taws xob yooj yim. Cov kab kev tsim qauv, xws li cov kab tswj kev tiv thaiv, microstrip lossis stripline configurations, thiab impedance txuam cov tswv yim, yog siv los ua kom zoo teeb liab kev ncaj ncees thiab txo cov teeb liab degradation.

6. Cheeb Tsam Chaw thiab Routing:Ua tib zoo tso thiab ua haujlwm ntawm cov khoom siv thiab cov cim taw qhia yog qhov tseem ceeb hauv kev tsim PCB ntau zaus kom txo cov teeb liab txoj kev ntev, zam kev khoov ntse, thiab txo cov kab mob cab uas tuaj yeem ua rau lub teeb liab tsis zoo.

7. High-Frequency Connectors:Cov Connectors siv nyob rau hauv high-frequency PCBs raug xaiv rau lawv impedance-matched yam ntxwv thiab tsis muaj insertion poob los txo cov teeb liab reflections thiab tswj cov teeb liab kev ncaj ncees ntawm high frequencies.

8. Thermal Management: Hauv qee qhov kev siv hluav taws xob high-frequency, kev tswj xyuas thermal ua qhov tseem ceeb los tiv thaiv overheating ntawm cov khoom thiab tswj kev ua haujlwm txhim khu kev qha. Thaum tshav kub kub dab dej, thermal vias, thiab thermal tswj cov txheej txheem yog ua hauj lwm los dissipate tshav kub zoo.