Hale Hana PCBA
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ʻO Circet kahi hale hana PCBA alakaʻi i hoʻokumu ʻia i ka makahiki 2007, e hāʻawi ana i ka lawelawe hoʻonā kī piha piha mai ka ʻāpana sourcing, SMT, DIP, manual soldering, testing, and mechanical assembly.Loaʻa iā mākou kahi ʻenehana R&D 15, hāʻawi i ka lawelawe ODM. Hiki iā ia ke hana PCB, hoʻolālā hoʻolālā, a me ka hoʻomohala ʻana i nā polokalamu. -
Hiki i ka hana kaapuni 1 Min.Applicable PCB nui 50x50 mm 2 Max.Applicable PCB nui 460x1500 mm 3 Min.component 01005 4 Min.QFP pitch 0.30 mm 5 Min.IC pitch 0.30 nm 6 Poepoe Min.BGA 0.25 mm 7 Max. SMT kiʻekiʻe 20 mm 8 Max. Nui BGA 74x74 mm 9 SMT hiki 9.5 miliona chips / lā 10 DIP hiki 700,000 ʻāpana / lā 11 laina SMT 9 12 laina DIP 2 13 laina hui mīkini 1
Aia nā laina 9 SMT, 4000 square meters mea kanu, 100 empolyees. ʻO kēlā me kēia laina he hoʻokahi mea paʻi paʻi solder maʻalahi, hoʻokahi mīkini pahu pahu pahu YAMAHA kiʻekiʻe, ʻelua mau mea hoʻokomo chip multifunction, a me hoʻokahi mīkini hoʻoheheʻe hou i ka umu 10. He 100,000 chips i kēlā me kēia hola i kēlā me kēia laina. E nānā ʻia nā papa āpau ma hope o SMT e AOI. E hoʻomoʻa ʻia ka mea kikoʻī e like me BGA ma mua o 12 mau hola ma mua o ka hui ʻana. E nānā ʻia ka ʻāpana kapuaʻi BGA a me QFN e ka X-ray i kēlā me kēia hola i ke kaʻina kau ʻana.
Aia hoʻokahi laina DIP, hoʻokahi laina soldering manual a me ka laina hui mechanical. Pau nā kaʻina hana hui i kā mākou hale hana.
Ua hana mākou i nā ʻano papa e like me nā mea uila uila, nā mea lapaʻau, ka ʻoihana kukui, ka huahana palekana, ka papa mana ʻoihana, kamaʻilio a pēlā aku, loaʻa ka ʻike waiwai ma ka papa paʻakikī a me ka hui FPC.
Hiki iā Circet ke lilo i mea kūʻai maikaʻi loa.